51646 QOLTEC
Виробник: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 0.5g
Type of chemical agent: heat transfer paste
Colour: silver
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 3.17W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Thermal resistance: max. 0.067°C/W
Net weight: 0.5g
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 0.5g
Type of chemical agent: heat transfer paste
Colour: silver
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 3.17W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Thermal resistance: max. 0.067°C/W
Net weight: 0.5g
на замовлення 11 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 4+ | 110.71 грн |
| 10+ | 103.33 грн |
Відгуки про товар
Написати відгук
Технічний опис 51646 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 0.5g, Type of chemical agent: heat transfer paste, Colour: silver, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 3.17W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Thermal resistance: max. 0.067°C/W, Net weight: 0.5g, кількість в упаковці: 1 шт.
Інші пропозиції 51646 за ціною від 123.99 грн до 150.49 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
51646 | Виробник : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 0.5g Type of chemical agent: heat transfer paste Colour: silver Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 3.17W/mK Kind of package: syringe Application: filling joints and micro-gaps between the processor and the base of the cooling system Thermal resistance: max. 0.067°C/W Net weight: 0.5g кількість в упаковці: 1 шт |
на замовлення 11 шт: термін постачання 7-14 дні (днів) |
|