51655 QOLTEC
Виробник: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 5.15W/mK; max.0.004°C/W; 1g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 5.15W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 1g
Thermal resistance: max. 0.004°C/W
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 5.15W/mK; max.0.004°C/W; 1g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 5.15W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 1g
Thermal resistance: max. 0.004°C/W
на замовлення 34 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 175.59 грн |
| 5+ | 155.06 грн |
| 10+ | 146.27 грн |
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Технічний опис 51655 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; grey; 5.15W/mK; max.0.004°C/W; 1g, Type of chemical agent: heat transfer paste, Colour: grey, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 5.15W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 1g, Thermal resistance: max. 0.004°C/W, кількість в упаковці: 1 шт.
Інші пропозиції 51655 за ціною від 175.52 грн до 210.71 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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51655 | Виробник : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; grey; 5.15W/mK; max.0.004°C/W; 1g Type of chemical agent: heat transfer paste Colour: grey Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 5.15W/mK Kind of package: syringe Application: filling joints and micro-gaps between the processor and the base of the cooling system Net weight: 1g Thermal resistance: max. 0.004°C/W кількість в упаковці: 1 шт |
на замовлення 34 шт: термін постачання 14-21 дні (днів) |
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