Виробник: SICK, Inc.
Description: LENS THROUGH-BEAM 2 PCS
Packaging: Bulk
For Use With/Related Products: Fiber Optics
Accessory Type: Fiber

Виробник: SCS
Description: TABLE MAT FOAM RUB/VINYL 3'
Packaging: Bulk
Features: Conductive, Dissipative
Color: Brown
Material: Foam Rubber, Vinyl
Length: 3' (0.91m)
Shape: Rectangle
Thickness: 0.14" (3.56mm)
Mat Type: Table, Workbench
Width: 2' (0.61m)
Number of Layers: 3

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33988
Packaging: Bulk
Function: High Side Driver (Internal FET)
Type: Power Management
Utilized IC / Part: MC33988
Supplied Contents: Board(s)
Primary Attributes: Output Current Monitoring, 2 SPI-Selectable Current Ratios
Embedded: No
Part Status: Active
Contents: Board(s)
Secondary Attributes: SPI Interface(s)

Виробник: NXP USA Inc.
Description: SOCKET MINI GRID 416-PGA 1.0MM
Packaging: Box
Module/Board Type: Adapter Board

Виробник: NXP USA Inc.
Description: QORIVVA MCSP5634M 176 PIN VERTIC
Packaging: Bulk
For Use With/Related Products: MCSP5634M
Accessory Type: Base Board
Utilized IC / Part: MCSP5634M

Виробник: Pulse Electronics
Description: FIXED IND 68UH 2.3A 130 MOHM SMD
Packaging: Tray
Tolerance: ±15%
Package / Case: Nonstandard
Size / Dimension: 0.733" L x 0.596" W (18.62mm x 15.14mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -40°C ~ 130°C
DC Resistance (DCR): 130mOhm Max
Current - Saturation (Isat): 3.2A
Inductance Frequency - Test: 100 kHz
Height - Seated (Max): 0.290" (7.36mm)
Inductance: 68 µH
Current Rating (Amps): 2.3 A