Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 1.330" (33.782mm)
Length - Post (Mating): 0.307" (7.798mm)
Length - Stack Height: 0.535" (13.589mm)
Length - Tail: 0.488" (12.395mm)

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 324MAPBGA
Packaging: Bulk
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified

Виробник: 3M
Description: STANDARD ABRASIVES S/C UNITIZED
Packaging: Bulk

Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 12 9OHM 48TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 85°C (TA)
On-State Resistance (Max): 9Ohm
-3db Bandwidth: 7.4GHz
Supplier Device Package: 48-TFBGA (3x8)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 400mOhm (Typ)
Part Status: Last Time Buy
Number of Circuits: 12

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified