Результат пошуку "566591" : 5
Вид перегляду :
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од. на суму грн.
Мінімальне замовлення: 17
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од. на суму грн.
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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CYT4BFCCHDQ0BZEGS | Infineon Technologies |
![]() Packaging: Tray Package / Case: 320-LFBGA Mounting Type: Surface Mount Speed: 100MHz, 350MHz Program Memory Size: 8.1875MB (8.1875M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Data Converters: A/D 114x12b SAR Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 320-BGA (17x17) Part Status: Active Number of I/O: 240 DigiKey Programmable: Not Verified |
на замовлення 900 шт: термін постачання 21-31 дні (днів) |
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VLS3012ET-100M | TDK Corporation |
![]() Packaging: Cut Tape (CT) Tolerance: ±20% Package / Case: Nonstandard Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Mounting Type: Surface Mount Shielding: Shielded Type: Drum Core, Wirewound Operating Temperature: -40°C ~ 105°C DC Resistance (DCR): 336mOhm Max Current - Saturation (Isat): 640mA Material - Core: Ferrite Inductance Frequency - Test: 1 MHz Height - Seated (Max): 0.047" (1.20mm) Part Status: Not For New Designs Inductance: 10 µH Current Rating (Amps): 640 mA |
на замовлення 685 шт: термін постачання 21-31 дні (днів) |
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CYT4BFCCHDQ0BZEGST | Infineon Technologies |
![]() Packaging: Tape & Reel (TR) Package / Case: 320-LFBGA Mounting Type: Surface Mount Speed: 100MHz, 350MHz Program Memory Size: 8.1875MB (8.1875M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Data Converters: A/D 114x12b SAR Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 320-BGA (17x17) Part Status: Active Number of I/O: 240 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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CYT4BFCCHDQ0BZSGS | Infineon Technologies |
![]() Packaging: Tray Package / Case: 320-LFBGA Mounting Type: Surface Mount Speed: 100MHz, 350MHz Program Memory Size: 8.1875MB (8.1875M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Data Converters: A/D 114x12b SAR Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 320-BGA (17x17) Part Status: Active Number of I/O: 240 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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VLS3012ET-100M | TDK Corporation |
![]() Packaging: Tape & Reel (TR) Tolerance: ±20% Package / Case: Nonstandard Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Mounting Type: Surface Mount Shielding: Shielded Type: Drum Core, Wirewound Operating Temperature: -40°C ~ 105°C DC Resistance (DCR): 336mOhm Max Current - Saturation (Isat): 640mA Material - Core: Ferrite Inductance Frequency - Test: 1 MHz Height - Seated (Max): 0.047" (1.20mm) Part Status: Not For New Designs Inductance: 10 µH Current Rating (Amps): 640 mA |
товару немає в наявності |
В кошику од. на суму грн. |
CYT4BFCCHDQ0BZEGS |
![]() |
Виробник: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tray
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tray
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
на замовлення 900 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3154.80 грн |
10+ | 2487.51 грн |
90+ | 2208.41 грн |
180+ | 2018.22 грн |
270+ | 1991.05 грн |
VLS3012ET-100M |
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Виробник: TDK Corporation
Description: FIXED IND 10UH 640MA 336MOHM SMD
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 336mOhm Max
Current - Saturation (Isat): 640mA
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Not For New Designs
Inductance: 10 µH
Current Rating (Amps): 640 mA
Description: FIXED IND 10UH 640MA 336MOHM SMD
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 336mOhm Max
Current - Saturation (Isat): 640mA
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Not For New Designs
Inductance: 10 µH
Current Rating (Amps): 640 mA
на замовлення 685 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
17+ | 18.84 грн |
21+ | 14.51 грн |
100+ | 11.92 грн |
CYT4BFCCHDQ0BZEGST |
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Виробник: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tape & Reel (TR)
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tape & Reel (TR)
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
CYT4BFCCHDQ0BZSGS |
![]() |
Виробник: Infineon Technologies
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tray
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC MCU 32BT 8.1875MB FLSH 320BGA
Packaging: Tray
Package / Case: 320-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 350MHz
Program Memory Size: 8.1875MB (8.1875M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 114x12b SAR
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 320-BGA (17x17)
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
VLS3012ET-100M |
![]() |
Виробник: TDK Corporation
Description: FIXED IND 10UH 640MA 336MOHM SMD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 336mOhm Max
Current - Saturation (Isat): 640mA
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Not For New Designs
Inductance: 10 µH
Current Rating (Amps): 640 mA
Description: FIXED IND 10UH 640MA 336MOHM SMD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Drum Core, Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 336mOhm Max
Current - Saturation (Isat): 640mA
Material - Core: Ferrite
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Part Status: Not For New Designs
Inductance: 10 µH
Current Rating (Amps): 640 mA
товару немає в наявності
В кошику
од. на суму грн.