5962-0324501QXA Texas Instruments
Виробник: Texas Instruments
Description: IC
Packaging: Bulk
Package / Case: 570-BFCPGA
Mounting Type: Through Hole
Interface: BSP, HPI, PCI, SPI
Type: Fixed Point
Operating Temperature: -55°C ~ 115°C (TA)
Non-Volatile Memory: External
On-Chip RAM: 1.03125MB
Voltage - I/O: 3.30V
Voltage - Core: 1.4V
Clock Rate: 600MHz
Supplier Device Package: 570-FCPGA (33.28x33.28)
Description: IC
Packaging: Bulk
Package / Case: 570-BFCPGA
Mounting Type: Through Hole
Interface: BSP, HPI, PCI, SPI
Type: Fixed Point
Operating Temperature: -55°C ~ 115°C (TA)
Non-Volatile Memory: External
On-Chip RAM: 1.03125MB
Voltage - I/O: 3.30V
Voltage - Core: 1.4V
Clock Rate: 600MHz
Supplier Device Package: 570-FCPGA (33.28x33.28)
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Технічний опис 5962-0324501QXA Texas Instruments
Description: IC, Packaging: Bulk, Package / Case: 570-BFCPGA, Mounting Type: Through Hole, Interface: BSP, HPI, PCI, SPI, Type: Fixed Point, Operating Temperature: -55°C ~ 115°C (TA), Non-Volatile Memory: External, On-Chip RAM: 1.03125MB, Voltage - I/O: 3.30V, Voltage - Core: 1.4V, Clock Rate: 600MHz, Supplier Device Package: 570-FCPGA (33.28x33.28).