66AK2G12ABYA60ES Texas Instruments

Description: PROTOTYPE, Packaging: Bulk, Package / Case: 625-LFBGA, FCBGA, Mounting Type: Surface Mount, Interface: CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB, Type: DSP+ARM®, Operating Temperature: -40°C ~ 105°C (TJ), Non-Volatile Memory: External, On-Chip RAM: 1Mb, Voltage - I/O: 1.8V, 3.3V, Voltage - Core: 0.9V, Clock Rate: 600MHz, Supplier Device Package: 625-FCBGA (21x21).