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70-3213-0811

70-3213-0811 Kester Solder

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Виробник: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 600GM
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
Shelf Life: 8 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 3
Form: Cartridge, 21.16 oz (600g)
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Технічний опис 70-3213-0811 Kester Solder

Description: SOLDER PASTE NXG1 NO CLEAN 600GM, Melting Point: 423 ~ 424°F (217 ~ 218°C), Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Packaging: Bulk, Shelf Life: 8 Months, Shelf Life Start: Date of Manufacture, Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C), Flux Type: No-Clean, Process: Lead Free, Mesh Type: 3, Form: Cartridge, 21.16 oz (600g).