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AD8313-EVALZ AD8313-EVALZ Analog Devices AD8313.pdf RF Development Tools AD8313 Evaluation Board
на замовлення 4 шт:
термін постачання 21-30 дні (днів)
1+12649.96 грн
В кошику  од. на суму  грн.
AD8313-EVALZ AD8313-EVALZ Analog Devices Inc. AD8313.pdf Description: BOARD EVAL FOR AD8313
Packaging: Bag
For Use With/Related Products: AD8313
Frequency: 100MHz ~ 2.5GHz
Type: Log Detector/Controller
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: AD8313
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+11184.74 грн
В кошику  од. на суму  грн.
DRV8313EVM DRV8313EVM Texas Instruments slvu815 Description: EVAL BOARD FOR DRV8313
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: DRV8313
Supplied Contents: Board(s)
Primary Attributes: 3 Half Bridge Drivers
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Contents: Board(s)
Secondary Attributes: USB Interface(s), Graphical User Interface (GUI)
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+8378.69 грн
В кошику  од. на суму  грн.
DRV8313EVM DRV8313EVM Texas Instruments slvu815 Power Management IC Development Tools DRV8313 EVAL MOD
на замовлення 5 шт:
термін постачання 21-30 дні (днів)
1+9814.23 грн
В кошику  од. на суму  грн.
MPC8313ECVRAFFC MPC8313ECVRAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
1+4297.46 грн
10+3417.36 грн
В кошику  од. на суму  грн.
MPC8313ECVRAFFC MPC8313ECVRAFFC NXP Semiconductors MPC8313EEC.pdf Microprocessors - MPU 8313 REV2.2 W/ENC EXT
на замовлення 39 шт:
термін постачання 21-30 дні (днів)
1+3894.48 грн
10+3322.28 грн
25+2747.57 грн
В кошику  од. на суму  грн.
MPC8313ECZQAFFC MPC8313ECZQAFFC Freescale Semiconductor FSCLS06086-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Bulk
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
6+2926.09 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MPC8313EVRAFFC MPC8313EVRAFFC NXP Semiconductors MPC8313EEC.pdf Microprocessors - MPU 8313 REV2.2 W/ENC
на замовлення 40 шт:
термін постачання 21-30 дні (днів)
1+4082.46 грн
10+3310.91 грн
25+2658.64 грн
120+2535.52 грн
280+2480.03 грн
В кошику  од. на суму  грн.
MPC8313EVRAFFC MPC8313EVRAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
1+3776.21 грн
10+2991.10 грн
В кошику  од. на суму  грн.
PIC16F18313-E/P PIC16F18313-E/P MICROCHIP TECHNOLOGY 40001799F.pdf Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; THT; DIP8; PIC16
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: THT
Case: DIP8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 2.54mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
на замовлення 8 шт:
термін постачання 21-30 дні (днів)
4+134.71 грн
5+117.17 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F18313-E/P PIC16F18313-E/P MICROCHIP TECHNOLOGY 40001799F.pdf Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; THT; DIP8; PIC16
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: THT
Case: DIP8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 2.54mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
кількість в упаковці: 1 шт
на замовлення 8 шт:
термін постачання 14-21 дні (днів)
2+161.66 грн
5+146.02 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PIC16F18313-E/P PIC16F18313-E/P Microchip Technology 40001799F.pdf Description: IC MCU 8BIT 3.5KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 471 шт:
термін постачання 21-31 дні (днів)
4+88.79 грн
25+78.79 грн
100+71.31 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F18313-E/P PIC16F18313-E/P Microchip Technology 40001799F.pdf 8-bit Microcontrollers - MCU 8-Bit MCU 3.5K Flash 256 RAM 256 EEPROM
на замовлення 2479 шт:
термін постачання 21-30 дні (днів)
4+95.77 грн
25+87.23 грн
120+68.63 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F18313-E/RF PIC16F18313-E/RF Microchip Technology 40001799F.pdf Description: IC MCU 8BIT 3.5KB FLASH 8UDFN
Packaging: Tube
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-UDFN (3x3)
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
5+74.82 грн
25+65.87 грн
100+59.77 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16F18313-E/SN PIC16F18313-E/SN Microchip Technology 40001799F.pdf 8-bit Microcontrollers - MCU 8-Bit MCU 3.5K Flash 256 RAM 256 EEPROM
на замовлення 1405 шт:
термін постачання 21-30 дні (днів)
5+75.46 грн
25+68.44 грн
100+53.58 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16F18313-E/SN PIC16F18313-E/SN Microchip Technology 40001799F.pdf Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 3709 шт:
термін постачання 21-31 дні (днів)
5+69.88 грн
25+61.79 грн
100+55.69 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16LF18313-E/RF PIC16LF18313-E/RF Microchip Technology 40001799F.pdf 8-bit Microcontrollers - MCU 8BIT MCU 3.5KB Flash 256 RAM, 256 EEPROM
на замовлення 1840 шт:
термін постачання 21-30 дні (днів)
5+80.87 грн
25+72.90 грн
120+57.84 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MPC8313ECVRAFF FREE MPC8313E_Hrdw_Spec.pdf
на замовлення 190 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
MPC8313EVRAFF FREESCALE MPC8313E_Hrdw_Spec.pdf SOT23
на замовлення 15000 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
MPC8313EVRAFFB MPC8313E_Hrdw_Spec.pdf
на замовлення 400 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
MPC8313EVRAGDC Freescale MPC8313E_Hrdw_Spec.pdf
на замовлення 469 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
5-083-13 BERNSTEIN BRN-5-083-13 ESD Tweezers
на замовлення 11 шт:
термін постачання 14-21 дні (днів)
1+1246.18 грн
2+1064.07 грн
3+1006.11 грн
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88313E 88313E Omega TC-K-NPT_RTD-NPT.pdf Description: THERMOCOUPLE PENETRATION PROBE,
Packaging: Bulk
Type: E-Type Thermocouple
Usage: Liquids, Gels
Tip Type: Immersion / Penetration, Pointed
Cable Length: 8.000" (203.20mm)
Plug Type: Sub-Mini (Thermocouple Plug)
Probe Material: Stainless Steel
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MPC8313E-RDB MPC8313E-RDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
товару немає в наявності
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MPC8313E-RDBC MPC8313E-RDBC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
товару немає в наявності
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MPC8313E-RDBC MPC8313E-RDBC NXP Semiconductors MPC8313E_Hrdw_Spec.pdf Development Boards & Kits - Other Processors 8313E CPU board Ver 2.2
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MPC8313ECVRADDB MPC8313ECVRADDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRADDC MPC8313ECVRADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRADDC NXP Semiconductors MPC8313EEC.pdf Microprocessors - MPU 8313 REV2.2 W/ENC EXT
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MPC8313ECVRAFF MPC8313ECVRAFF NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRAFFB MPC8313ECVRAFFB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRAGDC MPC8313ECVRAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313ECVRAGDC MPC8313ECVRAGDC NXP Semiconductors MPC8313EEC.pdf Microprocessors - MPU 8313 REV2.2 W/ENC EXT
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MPC8313ECZQADDC MPC8313ECZQADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAFFC MPC8313ECZQAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAGDC MPC8313ECZQAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRADDB MPC8313EVRADDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRADDC MPC8313EVRADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313EVRADDC MPC8313EVRADDC NXP Semiconductors MPC8313EEC.pdf Microprocessors - MPU 8313 REV2.2 W/ENC
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MPC8313EVRAFF MPC8313EVRAFF NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAFFB MPC8313EVRAFFB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDB MPC8313EVRAGDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDC MPC8313EVRAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313EVRAGDC NXP Semiconductors MPC8313EEC.pdf Microprocessors - MPU 8313 REV2.2 W/ENC
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MPC8313EZQADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Obsolete
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFB MPC8313EZQAFFB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFC MPC8313EZQAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAGDC MPC8313EZQAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MT8313ET MT8313ET NOVOSENSE MT831X_Series_Datasheet_Rev 2.1.pdf Description: HIGH PERFORMANCE AUTOMOTIVE GRAD
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Drain
Polarization: Unidirectional
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.8V ~ 60V
Technology: Hall Effect
Sensing Range: 11mT Trip, 2.5mT Release
Current - Output (Max): 40mA
Current - Supply (Max): 6mA
Supplier Device Package: SOT-23-3L
Test Condition: 25°C
Grade: Automotive
Qualification: AEC-Q100
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MT8313ET MT8313ET NOVOSENSE MT831X_Series_Datasheet_Rev 2.1.pdf Description: HIGH PERFORMANCE AUTOMOTIVE GRAD
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Drain
Polarization: Unidirectional
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.8V ~ 60V
Technology: Hall Effect
Sensing Range: 11mT Trip, 2.5mT Release
Current - Output (Max): 40mA
Current - Supply (Max): 6mA
Supplier Device Package: SOT-23-3L
Test Condition: 25°C
Grade: Automotive
Qualification: AEC-Q100
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PIC16F18313-E/MF PIC16F18313-E/MF Microchip Technology 40001799F.pdf Description: IC MCU 8BIT 3.5KB FLASH 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Not Verified
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PIC16F18313-E/MS PIC16F18313-E/MS Microchip Technology 40001799F.pdf Description: IC MCU 8BIT 3.5KB FLASH 8MSOP
Packaging: Tube
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-MSOP
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Not Verified
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PIC16F18313-E/RF MICROCHIP TECHNOLOGY 40001799F.pdf Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; SMD; uDFN8; tube
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: SMD
Case: uDFN8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 0.65mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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PIC16F18313-E/RF PIC16F18313-E/RF Microchip Technology 40001799F.pdf 8-bit Microcontrollers - MCU 8BIT MCU 3.5KB Flash 256 RAM, 256 EEPROM
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PIC16F18313-E/SN PIC16F18313-E/SN MICROCHIP TECHNOLOGY 40001799F.pdf Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; SMD; SO8; PIC16
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: SMD
Case: SO8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 1.27mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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PIC16F18313-E/SNVAO PIC16F18313-E/SNVAO Microchip Technology 40001799F.pdf Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PIC16LF18313-E/P PIC16LF18313-E/P MICROCHIP TECHNOLOGY 40001744C.pdf Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; MSSP (SPI / I2C),UART
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: MSSP (SPI / I2C); UART
Supply voltage: 1.8...3.6V DC
Mounting: THT
Case: DIP8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 2.54mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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PIC16LF18313-E/P PIC16LF18313-E/P Microchip Technology 40001744C.pdf Description: IC MCU 8BIT 3.5KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
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PIC16LF18313-E/P PIC16LF18313-E/P Microchip Technology 40001799F.pdf 8-bit Microcontrollers - MCU 8BIT MCU 3.5KB Flash 256 RAM, 256 EEPROM
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PIC16LF18313-E/RF PIC16LF18313-E/RF MICROCHIP TECHNOLOGY 40001744C.pdf Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; MSSP (SPI / I2C),UART
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: MSSP (SPI / I2C); UART
Supply voltage: 1.8...3.6V DC
Mounting: SMD
Case: uDFN8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 0.65mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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AD8313-EVALZ AD8313.pdf
AD8313-EVALZ
Виробник: Analog Devices
RF Development Tools AD8313 Evaluation Board
на замовлення 4 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
1+12649.96 грн
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AD8313-EVALZ AD8313.pdf
AD8313-EVALZ
Виробник: Analog Devices Inc.
Description: BOARD EVAL FOR AD8313
Packaging: Bag
For Use With/Related Products: AD8313
Frequency: 100MHz ~ 2.5GHz
Type: Log Detector/Controller
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: AD8313
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11184.74 грн
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DRV8313EVM slvu815
DRV8313EVM
Виробник: Texas Instruments
Description: EVAL BOARD FOR DRV8313
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: DRV8313
Supplied Contents: Board(s)
Primary Attributes: 3 Half Bridge Drivers
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Contents: Board(s)
Secondary Attributes: USB Interface(s), Graphical User Interface (GUI)
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8378.69 грн
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DRV8313EVM slvu815
DRV8313EVM
Виробник: Texas Instruments
Power Management IC Development Tools DRV8313 EVAL MOD
на замовлення 5 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
1+9814.23 грн
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MPC8313ECVRAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4297.46 грн
10+3417.36 грн
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MPC8313ECVRAFFC MPC8313EEC.pdf
MPC8313ECVRAFFC
Виробник: NXP Semiconductors
Microprocessors - MPU 8313 REV2.2 W/ENC EXT
на замовлення 39 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
1+3894.48 грн
10+3322.28 грн
25+2747.57 грн
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MPC8313ECZQAFFC FSCLS06086-1.pdf?t.download=true&u=5oefqw
MPC8313ECZQAFFC
Виробник: Freescale Semiconductor
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Bulk
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+2926.09 грн
Мінімальне замовлення: 6
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MPC8313EVRAFFC MPC8313EEC.pdf
MPC8313EVRAFFC
Виробник: NXP Semiconductors
Microprocessors - MPU 8313 REV2.2 W/ENC
на замовлення 40 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
1+4082.46 грн
10+3310.91 грн
25+2658.64 грн
120+2535.52 грн
280+2480.03 грн
В кошику  од. на суму  грн.
MPC8313EVRAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3776.21 грн
10+2991.10 грн
В кошику  од. на суму  грн.
PIC16F18313-E/P 40001799F.pdf
PIC16F18313-E/P
Виробник: MICROCHIP TECHNOLOGY
Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; THT; DIP8; PIC16
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: THT
Case: DIP8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 2.54mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
на замовлення 8 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
4+134.71 грн
5+117.17 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F18313-E/P 40001799F.pdf
PIC16F18313-E/P
Виробник: MICROCHIP TECHNOLOGY
Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; THT; DIP8; PIC16
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: THT
Case: DIP8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 2.54mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
кількість в упаковці: 1 шт
на замовлення 8 шт:
термін постачання 14-21 дні (днів)
Кількість Ціна
2+161.66 грн
5+146.02 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PIC16F18313-E/P 40001799F.pdf
PIC16F18313-E/P
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 471 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+88.79 грн
25+78.79 грн
100+71.31 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F18313-E/P 40001799F.pdf
PIC16F18313-E/P
Виробник: Microchip Technology
8-bit Microcontrollers - MCU 8-Bit MCU 3.5K Flash 256 RAM 256 EEPROM
на замовлення 2479 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
4+95.77 грн
25+87.23 грн
120+68.63 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F18313-E/RF 40001799F.pdf
PIC16F18313-E/RF
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8UDFN
Packaging: Tube
Package / Case: 8-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-UDFN (3x3)
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+74.82 грн
25+65.87 грн
100+59.77 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16F18313-E/SN 40001799F.pdf
PIC16F18313-E/SN
Виробник: Microchip Technology
8-bit Microcontrollers - MCU 8-Bit MCU 3.5K Flash 256 RAM 256 EEPROM
на замовлення 1405 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
5+75.46 грн
25+68.44 грн
100+53.58 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16F18313-E/SN 40001799F.pdf
PIC16F18313-E/SN
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 3709 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+69.88 грн
25+61.79 грн
100+55.69 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
PIC16LF18313-E/RF 40001799F.pdf
PIC16LF18313-E/RF
Виробник: Microchip Technology
8-bit Microcontrollers - MCU 8BIT MCU 3.5KB Flash 256 RAM, 256 EEPROM
на замовлення 1840 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
5+80.87 грн
25+72.90 грн
120+57.84 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
MPC8313ECVRAFF MPC8313E_Hrdw_Spec.pdf
Виробник: FREE
на замовлення 190 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
MPC8313EVRAFF MPC8313E_Hrdw_Spec.pdf
Виробник: FREESCALE
SOT23
на замовлення 15000 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
MPC8313EVRAFFB MPC8313E_Hrdw_Spec.pdf
на замовлення 400 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
MPC8313EVRAGDC MPC8313E_Hrdw_Spec.pdf
Виробник: Freescale
на замовлення 469 шт:
термін постачання 14-28 дні (днів)
В кошику  од. на суму  грн.
5-083-13
Виробник: BERNSTEIN
BRN-5-083-13 ESD Tweezers
на замовлення 11 шт:
термін постачання 14-21 дні (днів)
Кількість Ціна
1+1246.18 грн
2+1064.07 грн
3+1006.11 грн
В кошику  од. на суму  грн.
88313E TC-K-NPT_RTD-NPT.pdf
88313E
Виробник: Omega
Description: THERMOCOUPLE PENETRATION PROBE,
Packaging: Bulk
Type: E-Type Thermocouple
Usage: Liquids, Gels
Tip Type: Immersion / Penetration, Pointed
Cable Length: 8.000" (203.20mm)
Plug Type: Sub-Mini (Thermocouple Plug)
Probe Material: Stainless Steel
товару немає в наявності
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MPC8313E-RDB MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDB
Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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MPC8313E-RDBC MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDBC
Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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MPC8313E-RDBC MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDBC
Виробник: NXP Semiconductors
Development Boards & Kits - Other Processors 8313E CPU board Ver 2.2
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MPC8313ECVRADDB MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRADDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRADDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRADDC MPC8313EEC.pdf
Виробник: NXP Semiconductors
Microprocessors - MPU 8313 REV2.2 W/ENC EXT
товару немає в наявності
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MPC8313ECVRAFF MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRAFF
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRAFFB MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRAFFB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRAGDC
Виробник: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313ECVRAGDC MPC8313EEC.pdf
MPC8313ECVRAGDC
Виробник: NXP Semiconductors
Microprocessors - MPU 8313 REV2.2 W/ENC EXT
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MPC8313ECZQADDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECZQADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313ECZQAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECZQAGDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRADDB MPC8313E_Hrdw_Spec.pdf
MPC8313EVRADDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRADDC MPC8313E_Hrdw_Spec.pdf
MPC8313EVRADDC
Виробник: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313EVRADDC MPC8313EEC.pdf
MPC8313EVRADDC
Виробник: NXP Semiconductors
Microprocessors - MPU 8313 REV2.2 W/ENC
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MPC8313EVRAFF MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAFF
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAFFB MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAFFB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDB MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAGDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAGDC
Виробник: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313EVRAGDC MPC8313EEC.pdf
Виробник: NXP Semiconductors
Microprocessors - MPU 8313 REV2.2 W/ENC
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MPC8313EZQADDC MPC8313E_Hrdw_Spec.pdf
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Obsolete
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFB MPC8313E_Hrdw_Spec.pdf
MPC8313EZQAFFB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313EZQAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313EZQAGDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MT8313ET MT831X_Series_Datasheet_Rev 2.1.pdf
MT8313ET
Виробник: NOVOSENSE
Description: HIGH PERFORMANCE AUTOMOTIVE GRAD
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Drain
Polarization: Unidirectional
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.8V ~ 60V
Technology: Hall Effect
Sensing Range: 11mT Trip, 2.5mT Release
Current - Output (Max): 40mA
Current - Supply (Max): 6mA
Supplier Device Package: SOT-23-3L
Test Condition: 25°C
Grade: Automotive
Qualification: AEC-Q100
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MT8313ET MT831X_Series_Datasheet_Rev 2.1.pdf
MT8313ET
Виробник: NOVOSENSE
Description: HIGH PERFORMANCE AUTOMOTIVE GRAD
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Drain
Polarization: Unidirectional
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.8V ~ 60V
Technology: Hall Effect
Sensing Range: 11mT Trip, 2.5mT Release
Current - Output (Max): 40mA
Current - Supply (Max): 6mA
Supplier Device Package: SOT-23-3L
Test Condition: 25°C
Grade: Automotive
Qualification: AEC-Q100
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PIC16F18313-E/MF 40001799F.pdf
PIC16F18313-E/MF
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8DFN
Packaging: Tube
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-DFN (3x3)
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Not Verified
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PIC16F18313-E/MS 40001799F.pdf
PIC16F18313-E/MS
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8MSOP
Packaging: Tube
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-MSOP
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Not Verified
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PIC16F18313-E/RF 40001799F.pdf
Виробник: MICROCHIP TECHNOLOGY
Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; SMD; uDFN8; tube
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: SMD
Case: uDFN8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 0.65mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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PIC16F18313-E/RF 40001799F.pdf
PIC16F18313-E/RF
Виробник: Microchip Technology
8-bit Microcontrollers - MCU 8BIT MCU 3.5KB Flash 256 RAM, 256 EEPROM
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PIC16F18313-E/SN 40001799F.pdf
PIC16F18313-E/SN
Виробник: MICROCHIP TECHNOLOGY
Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; 2.3÷5.5VDC; SMD; SO8; PIC16
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: EUSART; I2C; LIN; PMBus; PPS; PWM; RS232; RS485; SMBus; SPI
Supply voltage: 2.3...5.5V DC
Mounting: SMD
Case: SO8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 1.27mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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PIC16F18313-E/SNVAO 40001799F.pdf
PIC16F18313-E/SNVAO
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 6
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PIC16LF18313-E/P 40001744C.pdf
PIC16LF18313-E/P
Виробник: MICROCHIP TECHNOLOGY
Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; MSSP (SPI / I2C),UART
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: MSSP (SPI / I2C); UART
Supply voltage: 1.8...3.6V DC
Mounting: THT
Case: DIP8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 2.54mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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PIC16LF18313-E/P 40001744C.pdf
PIC16LF18313-E/P
Виробник: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 3.5KB (2K x 14)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 5x10b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
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PIC16LF18313-E/P 40001799F.pdf
PIC16LF18313-E/P
Виробник: Microchip Technology
8-bit Microcontrollers - MCU 8BIT MCU 3.5KB Flash 256 RAM, 256 EEPROM
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PIC16LF18313-E/RF 40001744C.pdf
PIC16LF18313-E/RF
Виробник: MICROCHIP TECHNOLOGY
Category: 8-bit PIC family
Description: IC: PIC microcontroller; 3.5kB; 32MHz; MSSP (SPI / I2C),UART
Type of integrated circuit: PIC microcontroller
Program memory: 3.5kB
Clock frequency: 32MHz
Interface: MSSP (SPI / I2C); UART
Supply voltage: 1.8...3.6V DC
Mounting: SMD
Case: uDFN8
Integrated circuit features: Brown Out Reset (BOR); CCP x2; CLC x2; CWG; NCO; PMD; PPS
Number of inputs/outputs: 6/5
Number of 8bit timers: 2
Number of 16bit timers: 1
Kind of architecture: Harvard 8bit
Family: PIC16
Number of capacitive channels: 5
Kind of package: tube
Memory: 256B EEPROM; 256B SRAM; 3500B FLASH
Operating temperature: -40...125°C
Number of 10bit A/D converters: 2
Number of PWM channels: 2
Number of comparators: 1
Terminal pitch: 0.65mm
Operating frequency: 0...32MHz
Number of output compare channels: 2
Number of input capture channels: 2
Kind of core: 8-bit
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