A-ICS-254-14-TT50 Assmann WSW Components
Виробник: Assmann WSW ComponentsDescription: IC SOCKET, MACHINED PIN, 7.62MM,
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole, Right Angle
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Material - Post: Brass
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Технічний опис A-ICS-254-14-TT50 Assmann WSW Components
Description: IC SOCKET, MACHINED PIN, 7.62MM,, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Right Angle, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 14, Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 78.7µin (2.00µm), Contact Material - Post: Brass.