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ACA-SPI-006-K01

ACA-SPI-006-K01 LOTES

ACA-SPI-006-K01%20Drawing.pdf Виробник: LOTES
Description: SPI 16 PIN_IC 300mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
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Технічний опис ACA-SPI-006-K01 LOTES

Description: SPI 16 PIN_IC 300mil, Packaging: Tape & Reel (TR), Features: Board Guide, Closed Frame, Mounting Type: Surface Mount, Type: SOIC, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 1.00µin (0.025µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 1.00µin (0.025µm), Contact Material - Post: Phosphor Bronze.