ACC-HS3-SET Enclustra FPGA Solutions
Виробник: Enclustra FPGA Solutions
Description: ACC HEATSINK ME ACC-HS3
Packaging: Box
Fin Height: 0.571" (14.50mm)
Attachment Method: Bolt On
Width: 1.063" (27.00mm)
Shape: Rectangular
Length: 2.205" (56.00mm)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3183.32 грн |
| 10+ | 2712.54 грн |
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Технічний опис ACC-HS3-SET Enclustra FPGA Solutions
Description: ACC HEATSINK ME ACC-HS3, Packaging: Box, Fin Height: 0.571" (14.50mm), Attachment Method: Bolt On, Width: 1.063" (27.00mm), Shape: Rectangular, Length: 2.205" (56.00mm).


