Результат пошуку "ae1004" : 23

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Фото Назва Виробник Інформація Доступність
Ціна
DSC1001AE1-004.0000 DSC1001AE1-004.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
на замовлення 826 шт:
термін постачання 21-30 дні (днів)
5+70.46 грн
25+58.25 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
DSC1001AE1-004.0000 DSC1001AE1-004.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
на замовлення 309 шт:
термін постачання 21-31 дні (днів)
4+89.01 грн
10+83.98 грн
50+82.69 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
HAE100-48S12W HAE100-48S12W P-DUKE Technology hae100w_datasheet.pdf Description: DC DC CONVERTER 12V 101W
Features: Adjustable Output, Remote On/Off, Remote Sense
Packaging: Box
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 8.4A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 12V
Control Features: Enable, Active Low
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+11656.89 грн
В кошику  од. на суму  грн.
HAE100-48S24W HAE100-48S24W P-DUKE Technology hae100w_datasheet.pdf Description: DC DC CONVERTER 24V 101W
Features: Adjustable Output, Baseplate, Remote On/Off, Remote Sense
Packaging: Bulk
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C (With Derating)
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 4.2A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 24V
Control Features: Enable, Active Low
Part Status: Active
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
Standard Number: 60950-1
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+11656.89 грн
В кошику  од. на суму  грн.
AR 14-HZW/TN AR 14-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 294 шт:
термін постачання 21-31 дні (днів)
2+198.43 грн
10+162.07 грн
34+148.64 грн
68+132.83 грн
102+129.08 грн
272+120.45 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
DSC1001AE1-004.0000T DSC1001AE1-004.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
товару немає в наявності
В кошику  од. на суму  грн.
DSC1001AE1-004.0000T DSC1001AE1-004.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
товару немає в наявності
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DSC1121AE1-004.0000 DSC1121AE1-004.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
товару немає в наявності
В кошику  од. на суму  грн.
DSC1121AE1-004.0000 DSC1121AE1-004.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
товару немає в наявності
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DSC1121AE1-004.0000T DSC1121AE1-004.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSCILLATOR LOW JITTER
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
товару немає в наявності
В кошику  од. на суму  грн.
DSC1121AE1-004.0000T DSC1121AE1-004.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
товару немає в наявності
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Si5386A-E10044-GM Si5386A-E10044-GM Skyworks Solutions, Inc. si5386_datasheet.pdf Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
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Si5386A-E10044-GMR Si5386A-E10044-GMR Skyworks Solutions, Inc. si5386_datasheet.pdf Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
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AK140-2 AK140-2 Assmann WSW Components Description: CBL ASSY CENTRON 36POS FEM-M 2M
Packaging: Bag
Length: 6.56' (2.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
товару немає в наявності
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AR 08-HZW/TN AR 08-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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AR 16-HZW/TN AR 16-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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AR 18-HZW/TN AR 18-HZW/TN Assmann WSW Components ASS_6290_CO.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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AR 24-HZL/07/7-TT AR 24-HZL/07/7-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
AR 28-HZL/07-TT AR 28-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
AR 28-HZL/07/7-TT AR 28-HZL/07/7-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
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AR 32-HZL/07-TT AR 32-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
AR 40-HZL/07-TT AR 40-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
AR 48-HZL/07-TT AR 48-HZL/07-TT Assmann WSW Components ASS_4852_CO.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику  од. на суму  грн.
DSC1001AE1-004.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE1-004.0000
Виробник: Microchip Technology
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
на замовлення 826 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна
5+70.46 грн
25+58.25 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
DSC1001AE1-004.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE1-004.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
на замовлення 309 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+89.01 грн
10+83.98 грн
50+82.69 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
HAE100-48S12W hae100w_datasheet.pdf
HAE100-48S12W
Виробник: P-DUKE Technology
Description: DC DC CONVERTER 12V 101W
Features: Adjustable Output, Remote On/Off, Remote Sense
Packaging: Box
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 8.4A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 12V
Control Features: Enable, Active Low
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11656.89 грн
В кошику  од. на суму  грн.
HAE100-48S24W hae100w_datasheet.pdf
HAE100-48S24W
Виробник: P-DUKE Technology
Description: DC DC CONVERTER 24V 101W
Features: Adjustable Output, Baseplate, Remote On/Off, Remote Sense
Packaging: Bulk
Package / Case: Half Brick
Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61.0mm x 57.9mm x 12.7mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 105°C (With Derating)
Applications: ITE (Commercial)
Voltage - Input (Max): 75V
Approval Agency: CB, CE, cURus
Efficiency: 90%
Current - Output (Max): 4.2A
Supplier Device Package: Half Brick
Voltage - Input (Min): 16.5V
Voltage - Output 1: 24V
Control Features: Enable, Active Low
Part Status: Active
Power (Watts): 101 W
Number of Outputs: 1
Voltage - Isolation: 3 kV
Standard Number: 60950-1
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11656.89 грн
В кошику  од. на суму  грн.
AR 14-HZW/TN ASS_6290_CO.pdf
AR 14-HZW/TN
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 294 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+198.43 грн
10+162.07 грн
34+148.64 грн
68+132.83 грн
102+129.08 грн
272+120.45 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
DSC1001AE1-004.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE1-004.0000T
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
товару немає в наявності
В кошику  од. на суму  грн.
DSC1001AE1-004.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE1-004.0000T
Виробник: Microchip Technology
Standard Clock Oscillators MEMS Oscillator Low PWR LVCMOS -20C-70C
товару немає в наявності
В кошику  од. на суму  грн.
DSC1121AE1-004.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121AE1-004.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC1121AE1-004.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121AE1-004.0000
Виробник: Microchip Technology
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
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DSC1121AE1-004.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121AE1-004.0000T
Виробник: Microchip Technology
Description: MEMS OSCILLATOR LOW JITTER
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC1121AE1-004.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121AE1-004.0000T
Виробник: Microchip Technology
Standard Clock Oscillators MEMS OSC, LVCMOS, 4MHz, 50PPM, 2.5-3.3V, -20 to 70C, 7.0 x 5.0mm
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Si5386A-E10044-GM si5386_datasheet.pdf
Si5386A-E10044-GM
Виробник: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
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Si5386A-E10044-GMR si5386_datasheet.pdf
Si5386A-E10044-GMR
Виробник: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
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AK140-2
AK140-2
Виробник: Assmann WSW Components
Description: CBL ASSY CENTRON 36POS FEM-M 2M
Packaging: Bag
Length: 6.56' (2.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
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AR 08-HZW/TN ASS_6290_CO.pdf
AR 08-HZW/TN
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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AR 16-HZW/TN ASS_6290_CO.pdf
AR 16-HZW/TN
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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AR 18-HZW/TN ASS_6290_CO.pdf
AR 18-HZW/TN
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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AR 24-HZL/07/7-TT ASS_4852_CO.pdf
AR 24-HZL/07/7-TT
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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AR 28-HZL/07-TT ASS_4852_CO.pdf
AR 28-HZL/07-TT
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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AR 28-HZL/07/7-TT ASS_4852_CO.pdf
AR 28-HZL/07/7-TT
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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AR 32-HZL/07-TT ASS_4852_CO.pdf
AR 32-HZL/07-TT
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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AR 40-HZL/07-TT ASS_4852_CO.pdf
AR 40-HZL/07-TT
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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AR 48-HZL/07-TT ASS_4852_CO.pdf
AR 48-HZL/07-TT
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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