APTGX300A170TDP3EG MICROCHIP TECHNOLOGY
Виробник: MICROCHIP TECHNOLOGY
Category: IGBT modules
Description: Module: IGBT; NTC thermistor; Ic: 300A; 1.311kW
Type of semiconductor module: IGBT
Collector current: 300A
Power dissipation: 1.311kW
Topology: NTC thermistor
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Технічний опис APTGX300A170TDP3EG MICROCHIP TECHNOLOGY
Category: IGBT modules, Description: Module: IGBT; NTC thermistor; Ic: 300A; 1.311kW, Type of semiconductor module: IGBT, Collector current: 300A, Power dissipation: 1.311kW, Topology: NTC thermistor.