AR 20-HZW/TN Assmann WSW Components
Виробник: Assmann WSW ComponentsDescription: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
на замовлення 5025 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 175.13 грн |
| 24+ | 134.47 грн |
| 48+ | 128.04 грн |
| 72+ | 116.78 грн |
| 120+ | 112.64 грн |
| 264+ | 106.54 грн |
| 504+ | 100.12 грн |
| 1008+ | 95.34 грн |
| 2520+ | 89.38 грн |
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Технічний опис AR 20-HZW/TN Assmann WSW Components
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Wire Wrap, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.