AR 20-HZW/TN Assmann WSW Components
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
| Кількість | Ціна |
|---|---|
| 2+ | 167.32 грн |
| 24+ | 128.76 грн |
| 48+ | 122.60 грн |
| 72+ | 111.81 грн |
| 120+ | 107.85 грн |
| 264+ | 102.01 грн |
| 504+ | 95.86 грн |
| 1008+ | 91.29 грн |
| 2520+ | 85.58 грн |
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Технічний опис AR 20-HZW/TN Assmann WSW Components
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Wire Wrap, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.