AR 32-HZL/01-TT Assmann WSW Components
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
| Кількість | Ціна |
|---|---|
| 3+ | 142.30 грн |
| 14+ | 108.37 грн |
| 28+ | 101.85 грн |
| 56+ | 89.87 грн |
| 112+ | 84.51 грн |
| 252+ | 78.65 грн |
| 504+ | 72.75 грн |
| 1008+ | 68.42 грн |
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Технічний опис AR 32-HZL/01-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 32POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.
Інші пропозиції AR 32-HZL/01-TT
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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AR-32-HZL/01-TT | Виробник : Assmann WSW Components |
Description: CONN IC DIP SOCKET 32POS GOLD |
на замовлення 708 шт: термін постачання 21-31 дні (днів) |
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AR32-HZL/01-TT | Виробник : Assmann WSW Components | Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |