AR 16 HZL-TT Assmann WSW Components
| Кількість | Ціна |
|---|---|
| 5+ | 64.23 грн |
| 10+ | 52.30 грн |
| 29+ | 50.16 грн |
| 58+ | 46.08 грн |
| 87+ | 44.07 грн |
| 232+ | 40.07 грн |
| 464+ | 35.47 грн |
| 957+ | 31.53 грн |
| 2407+ | 28.57 грн |
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Технічний опис AR 16 HZL-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції AR 16 HZL-TT за ціною від 34.94 грн до 68.19 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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AR 16-HZL-TT | Assmann WSW Components |
 Description: CONN IC DIP SOCKET 16POS TINPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 7605 шт: термін постачання 21-31 дні (днів) |
|
| AR 16-HZL-TT |
|
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET 16POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 7605 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 68.19 грн |
| 10+ | 55.97 грн |
| 29+ | 51.87 грн |
| 58+ | 46.36 грн |
| 116+ | 44.14 грн |
| 261+ | 41.68 грн |
| 522+ | 39.04 грн |
| 1015+ | 37.25 грн |
| 2523+ | 34.94 грн |