AR 28 HZL-TT Assmann WSW Components
| Кількість | Ціна |
|---|---|
| 3+ | 113.39 грн |
| 16+ | 95.06 грн |
| 32+ | 90.98 грн |
| 48+ | 83.50 грн |
| 80+ | 79.70 грн |
| 240+ | 72.11 грн |
| 448+ | 65.33 грн |
| 960+ | 56.00 грн |
| 2400+ | 52.26 грн |
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Технічний опис AR 28 HZL-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS TIN, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Polyester, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Operating Temperature: -40°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції AR 28 HZL-TT за ціною від 65.21 грн до 119.73 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AR 28-HZL-TT | Assmann WSW Components |
 Description: CONN IC DIP SOCKET 28POS TINPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic, Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -40°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 1181 шт: термін постачання 21-31 дні (днів) |
|
| AR 28-HZL-TT |
|
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic, Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -40°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 28POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic, Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -40°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
на замовлення 1181 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 119.73 грн |
| 16+ | 94.63 грн |
| 32+ | 90.12 грн |
| 64+ | 80.55 грн |
| 112+ | 77.42 грн |
| 256+ | 73.03 грн |
| 512+ | 68.40 грн |
| 1008+ | 65.21 грн |