ART.AGT-262 AG TERMOPASTY
Виробник: AG TERMOPASTY
Category: Encapsulating materials
Description: Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm
Type of chemical agent: silicone encapsulating compound
Colour: white
Application: sealing and encapsulation of electronic circuits
Shore hardness: 59
Operating temperature: -50...200°C
Thermal conductivity: 1.2W/mK
Density: 1.2g/cm3 @ 25°C
Dielectric strength: 20kV/mm
Mix ratio: 100:10
Bonding time: 30min
Dielectric constant: 3
Appearance: paste
Available labels languages: BG; CZ; EN; ES; FI; FR; HU; IT; PL; RO; SK
Surface resistance: <2410TΩ
Agent features: condensation cure; two-component
Curing method: RTV
Net weight: 1kg
Category: Encapsulating materials
Description: Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm
Type of chemical agent: silicone encapsulating compound
Colour: white
Application: sealing and encapsulation of electronic circuits
Shore hardness: 59
Operating temperature: -50...200°C
Thermal conductivity: 1.2W/mK
Density: 1.2g/cm3 @ 25°C
Dielectric strength: 20kV/mm
Mix ratio: 100:10
Bonding time: 30min
Dielectric constant: 3
Appearance: paste
Available labels languages: BG; CZ; EN; ES; FI; FR; HU; IT; PL; RO; SK
Surface resistance: <2410TΩ
Agent features: condensation cure; two-component
Curing method: RTV
Net weight: 1kg
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Технічний опис ART.AGT-262 AG TERMOPASTY
Category: Encapsulating materials, Description: Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm, Type of chemical agent: silicone encapsulating compound, Colour: white, Application: sealing and encapsulation of electronic circuits, Shore hardness: 59, Operating temperature: -50...200°C, Thermal conductivity: 1.2W/mK, Density: 1.2g/cm3 @ 25°C, Dielectric strength: 20kV/mm, Mix ratio: 100:10, Bonding time: 30min, Dielectric constant: 3, Appearance: paste, Available labels languages: BG; CZ; EN; ES; FI; FR; HU; IT; PL; RO; SK, Surface resistance: .