ASPI0002-P001A LOTES
Виробник: LOTESDescription: SPI 8Pin WSON 8X6
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3400 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 10+ | 1468.11 грн |
| 50+ | 706.87 грн |
| 100+ | 424.12 грн |
| 200+ | 265.35 грн |
| 700+ | 132.67 грн |
Відгуки про товар
Написати відгук
Технічний опис ASPI0002-P001A LOTES
Description: SPI 8Pin WSON 8X6, Features: Board Guide, Closed Frame, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: SOIC, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Phosphor Bronze, Part Status: Active.