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B81122A1154M

B81122A1154M EPCOS - TDK Electronics

B81122.pdf Виробник: EPCOS - TDK Electronics
Description: CAP FILM 0.15UF 20% 250VAC RAD
Packaging: Bulk
Tolerance: ±20%
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 100°C
Applications: EMI, RFI Suppression
Lead Spacing: 1.083" (27.50mm)
Termination: PC Pins
Dielectric Material: Polypropylene (PP)
Voltage Rating - AC: 250V
Height - Seated (Max): 0.827" (21.00mm)
Capacitance: 0.15 µF
Size / Dimension: 1.240" L x 0.433" W (31.50mm x 11.00mm)
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Технічний опис B81122A1154M EPCOS - TDK Electronics

Description: CAP FILM 0.15UF 20% 250VAC RAD, Packaging: Bulk, Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 100°C, Applications: EMI, RFI Suppression, Lead Spacing: 1.083" (27.50mm), Termination: PC Pins, Dielectric Material: Polypropylene (PP), Voltage Rating - AC: 250V, Height - Seated (Max): 0.827" (21.00mm), Capacitance: 0.15 µF, Size / Dimension: 1.240" L x 0.433" W (31.50mm x 11.00mm).