BDN09-3CB CTS Thermal Management Products
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Виробник: CTS Thermal Management Products
Description: HEATSINK CPU .91" SQ
Material: Aluminum
Packaging: Box
Material Finish: Black Anodized
Fin Height: 0.355" (9.02mm)
Thermal Resistance @ Natural: 26.90°C/W
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
Attachment Method: Thermal Tape, Adhesive (Not Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.910" (23.11mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.910" (23.11mm)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 109.42 грн |
| 10+ | 100.33 грн |
| 25+ | 97.71 грн |
| 50+ | 89.21 грн |
| 100+ | 84.25 грн |
| 250+ | 79.30 грн |
| 500+ | 73.12 грн |
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Технічний опис BDN09-3CB CTS Thermal Management Products
Description: HEATSINK CPU .91" SQ, Material: Aluminum, Packaging: Box, Material Finish: Black Anodized, Fin Height: 0.355" (9.02mm), Thermal Resistance @ Natural: 26.90°C/W, Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM, Attachment Method: Thermal Tape, Adhesive (Not Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 0.910" (23.11mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.910" (23.11mm).