BDN12-5CB/A01 CTS Thermal Management Products
Виробник: CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.21"SQ
Packaging: Box
Material: Aluminum
Length: 1.210" (30.73mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.210" (30.73mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.555" (14.10mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK CPU W/ADHESIVE 1.21"SQ
Packaging: Box
Material: Aluminum
Length: 1.210" (30.73mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.210" (30.73mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.555" (14.10mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1582 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
2+ | 217.89 грн |
10+ | 204.43 грн |
25+ | 198.97 грн |
50+ | 176.33 грн |
100+ | 165.96 грн |
250+ | 155.59 грн |
500+ | 147.94 грн |
1000+ | 132.63 грн |
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Технічний опис BDN12-5CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.21"SQ, Packaging: Box, Material: Aluminum, Length: 1.210" (30.73mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.210" (30.73mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 400 LFM, Thermal Resistance @ Natural: 16.50°C/W, Fin Height: 0.555" (14.10mm), Material Finish: Black Anodized, Part Status: Active.
Інші пропозиції BDN12-5CB/A01
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
BDN125CBA01 | Виробник : CTS Electronic Components | Heat Sinks IERC Heat Sink 1.21x1.21x0.555 |
товар відсутній |