BGAH190-090E Ohmite
Виробник: Ohmite
Description: BGA HEATSINK W/TAPE
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.354" (9.00mm)
Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: BGA, CPU, GPU
Width: 0.748" (19.00mm)
Type: Top Mount
Shape: Square, Angled Fins
Length: 0.748" (19.00mm)
Material: Aluminum Alloy
Packaging: Box
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Технічний опис BGAH190-090E Ohmite
Description: BGA HEATSINK W/TAPE, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.354" (9.00mm), Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: BGA, CPU, GPU, Width: 0.748" (19.00mm), Type: Top Mount, Shape: Square, Angled Fins, Length: 0.748" (19.00mm), Material: Aluminum Alloy, Packaging: Box.
Інші пропозиції BGAH190-090E
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
BGAH190-090E | Виробник : Ohmite |
Heat Sinks 19mm x 19mm x 9.0mm BGA Heatsink w/tape |
товару немає в наявності |