BU640Z-178-HT On Shore Technology Inc.
Виробник: On Shore Technology Inc.Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Copper
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Part Status: Obsolete
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Технічний опис BU640Z-178-HT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 64POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Surface Mount, Type: DIP, 0.9" (22.86mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Copper, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Brass, Part Status: Obsolete.