BZ6AB906GMP-TR Rohm Semiconductor


BZ6Axx06GMP.pdf Виробник: Rohm Semiconductor
Description: IC PWR SUPP MOD 1.85V BGA-MDP
Features: Remote On/Off
Packaging: Tape & Reel (TR)
Package / Case: 8-TFBGA Module
Size / Dimension: 0.11" L x 0.09" W x 0.04" H (2.9mm x 2.3mm x 1.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Current - Output (Max): 650mA
Supplier Device Package: BGA-MDP
Voltage - Input (Min): 2.3V
Voltage - Output 1: 1.85V
Number of Outputs: 1
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Технічний опис BZ6AB906GMP-TR Rohm Semiconductor

Description: IC PWR SUPP MOD 1.85V BGA-MDP, Features: Remote On/Off, Packaging: Tape & Reel (TR), Package / Case: 8-TFBGA Module, Size / Dimension: 0.11" L x 0.09" W x 0.04" H (2.9mm x 2.3mm x 1.0mm), Mounting Type: Surface Mount, Type: Non-Isolated PoL Module, Operating Temperature: -40°C ~ 85°C, Applications: ITE (Commercial), Voltage - Input (Max): 5.5V, Current - Output (Max): 650mA, Supplier Device Package: BGA-MDP, Voltage - Input (Min): 2.3V, Voltage - Output 1: 1.85V, Number of Outputs: 1.