CC6001031AP Canfield Technologies
Виробник: Canfield Technologies
Description: 60SN/40PB NO CLEAN 1 LB .031 DIA
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Form: Spool, 1 lb (453.59g)
Melting Point: 363°F (184°C)
Type: Wire Solder
Composition: Sn60Pb40 (60/40)
Wire Gauge: 20 AWG, 22 SWG
Diameter: 0.031" (0.79mm)
Packaging: Spool
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Технічний опис CC6001031AP Canfield Technologies
Description: 60SN/40PB NO CLEAN 1 LB .031 DIA, Shelf Life: 24 Months, Shelf Life Start: Date of Manufacture, Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C), Part Status: Active, Flux Type: No-Clean, Process: Leaded, Form: Spool, 1 lb (453.59g), Melting Point: 363°F (184°C), Type: Wire Solder, Composition: Sn60Pb40 (60/40), Wire Gauge: 20 AWG, 22 SWG, Diameter: 0.031" (0.79mm), Packaging: Spool.


