CCBLF22701020 Canfield Technologies
Виробник: Canfield Technologies
Description: BLF 227 NO CLEAN FLUX 1 LB. .020
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Form: Spool, 1 lb (453.59g)
Melting Point: 440°F (227°C)
Type: Wire Solder
Composition: BLF 227 (99.17Sn/.8Cu/.03Ni)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
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Технічний опис CCBLF22701020 Canfield Technologies
Description: BLF 227 NO CLEAN FLUX 1 LB. .020, Shelf Life: 24 Months, Shelf Life Start: Date of Manufacture, Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C), Part Status: Active, Flux Type: No-Clean, Process: Lead Free, Form: Spool, 1 lb (453.59g), Melting Point: 440°F (227°C), Type: Wire Solder, Composition: BLF 227 (99.17Sn/.8Cu/.03Ni), Wire Gauge: 24 AWG, 25 SWG, Diameter: 0.020" (0.51mm), Packaging: Spool.


