CCBLF22701020 Canfield Technologies
Виробник: Canfield Technologies
Description: BLF 227 NO CLEAN FLUX 1 LB. .020
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: BLF 227 (99.17Sn/.8Cu/.03Ni)
Type: Wire Solder
Melting Point: 440°F (227°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: BLF 227 NO CLEAN FLUX 1 LB. .020
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: BLF 227 (99.17Sn/.8Cu/.03Ni)
Type: Wire Solder
Melting Point: 440°F (227°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4925.84 грн |
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Технічний опис CCBLF22701020 Canfield Technologies
Description: BLF 227 NO CLEAN FLUX 1 LB. .020, Packaging: Spool, Diameter: 0.020" (0.51mm), Wire Gauge: 24 AWG, 25 SWG, Composition: BLF 227 (99.17Sn/.8Cu/.03Ni), Type: Wire Solder, Melting Point: 440°F (227°C), Form: Spool, 1 lb (453.59g), Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C), Shelf Life Start: Date of Manufacture, Shelf Life: 24 Months.