CCBLF227L2031P Canfield Technologies
Виробник: Canfield Technologies
Description: BLF 227 NO CLEAN FLUX 8 OZ .031
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: BLF 227 (99.17Sn/.8Cu/.03Ni)
Type: Wire Solder
Melting Point: 440°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: BLF 227 NO CLEAN FLUX 8 OZ .031
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: BLF 227 (99.17Sn/.8Cu/.03Ni)
Type: Wire Solder
Melting Point: 440°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2534.96 грн |
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Технічний опис CCBLF227L2031P Canfield Technologies
Description: BLF 227 NO CLEAN FLUX 8 OZ .031, Packaging: Spool, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 22 SWG, Composition: BLF 227 (99.17Sn/.8Cu/.03Ni), Type: Wire Solder, Melting Point: 440°F (227°C), Form: Spool, 8 oz (227g), 1/2 lb, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C), Shelf Life Start: Date of Manufacture, Shelf Life: 24 Months.