
CHQ05-6N2J-RC Allied Components International

Description: 6.2NH 5% CERAMIC CORE HI Q CHIP
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.090" L x 0.070" W (2.29mm x 1.78mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -40°C ~ 125°C
DC Resistance (DCR): 35mOhm Max
Q @ Freq: 88 @ 1GHz
Frequency - Self Resonant: 4.75GHz
Material - Core: Ceramic
Inductance Frequency - Test: 250 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.060" (1.52mm)
Part Status: Active
Inductance: 6.2 nH
Current Rating (Amps): 1.6 A
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна |
---|---|
5+ | 68.80 грн |
10+ | 64.98 грн |
15+ | 57.40 грн |
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Технічний опис CHQ05-6N2J-RC Allied Components International
Description: 6.2NH 5% CERAMIC CORE HI Q CHIP, Packaging: Tape & Reel (TR), Tolerance: ±5%, Package / Case: 0805 (2012 Metric), Size / Dimension: 0.090" L x 0.070" W (2.29mm x 1.78mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -40°C ~ 125°C, DC Resistance (DCR): 35mOhm Max, Q @ Freq: 88 @ 1GHz, Frequency - Self Resonant: 4.75GHz, Material - Core: Ceramic, Inductance Frequency - Test: 250 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.060" (1.52mm), Part Status: Active, Inductance: 6.2 nH, Current Rating (Amps): 1.6 A.