CIG10F2R2MNC SAMSUNGEM
Виробник: SAMSUNGEMInductor Power Chip Shielded Multi-Layer 2.2uH 20% 1MHz Ferrite 0.5A 0.45Ohm DCR 0603 T/R
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Технічний опис CIG10F2R2MNC SAMSUNGEM
Description: FIXED IND 2.2UH 500MA 450MOHM SM, Packaging: Tape & Reel (TR), Tolerance: ±20%, Package / Case: 0603 (1608 Metric), Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm), Mounting Type: Surface Mount, Shielding: Shielded, Type: Multilayer, Operating Temperature: -40°C ~ 125°C, DC Resistance (DCR): 450mOhm, Inductance Frequency - Test: 1 MHz, Supplier Device Package: 0603 (1608 Metric), Inductance: 2.2 µH, Current Rating (Amps): 500 mA.
Інші пропозиції CIG10F2R2MNC
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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CIG10F2R2MNC | Виробник : Samsung Electro-Mechanics |
Description: FIXED IND 2.2UH 500MA 450MOHM SM Packaging: Tape & Reel (TR) Tolerance: ±20% Package / Case: 0603 (1608 Metric) Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm) Mounting Type: Surface Mount Shielding: Shielded Type: Multilayer Operating Temperature: -40°C ~ 125°C DC Resistance (DCR): 450mOhm Inductance Frequency - Test: 1 MHz Supplier Device Package: 0603 (1608 Metric) Inductance: 2.2 µH Current Rating (Amps): 500 mA |
товару немає в наявності |
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CIG10F2R2MNC | Виробник : Samsung Electro-Mechanics |
Description: FIXED IND 2.2UH 500MA 450MOHM SM Packaging: Cut Tape (CT) Tolerance: ±20% Package / Case: 0603 (1608 Metric) Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm) Mounting Type: Surface Mount Shielding: Shielded Type: Multilayer Operating Temperature: -40°C ~ 125°C DC Resistance (DCR): 450mOhm Inductance Frequency - Test: 1 MHz Supplier Device Package: 0603 (1608 Metric) Inductance: 2.2 µH Current Rating (Amps): 500 mA |
товару немає в наявності |