Технічний опис CL10B104KB8ZW6C SAMSUNGEM
Description: CAP CER 0.1UF 50V X7R 0603, Tolerance: ±10%, Features: Soft Termination, Packaging: Tape & Reel (TR), Voltage - Rated: 50V, Package / Case: 0603 (1608 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: Boardflex Sensitive, Thickness (Max): 0.035" (0.90mm), Capacitance: 0.1 µF.
Інші пропозиції CL10B104KB8ZW6C
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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CL10B104KB8ZW6C | Виробник : Samsung Electro-Mechanics |
 Description: CAP CER 0.1UF 50V X7R 0603Packaging: Cut Tape (CT) Tolerance: ±10% Features: Soft Termination Voltage - Rated: 50V Package / Case: 0603 (1608 Metric) Temperature Coefficient: X7R Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Boardflex Sensitive Thickness (Max): 0.035" (0.90mm) Capacitance: 0.1 µF |
товару немає в наявності |
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CL10B104KB8ZW6C | Виробник : Samsung Electro-Mechanics |
Description: CAP CER 0.1UF 50V X7R 0603 Tolerance: ±10% Features: Soft Termination Packaging: Tape & Reel (TR) Voltage - Rated: 50V Package / Case: 0603 (1608 Metric) Temperature Coefficient: X7R Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Boardflex Sensitive Thickness (Max): 0.035" (0.90mm) Capacitance: 0.1 µF |
товару немає в наявності |