Продукція > SAMTEC INC. > CLP-205-02-F-D-BE-PA-TR

CLP-205-02-F-D-BE-PA-TR Samtec Inc.



Виробник: Samtec Inc.
Description: CONN RCPT 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Termination: Solder
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle, Bottom Entry
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
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Технічний опис CLP-205-02-F-D-BE-PA-TR Samtec Inc.

Description: CONN RCPT 0.05 GOLD SMD, Features: Pick and Place, Packaging: Tape & Reel (TR), Termination: Solder, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Bottom Entry, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0.