DC0402T Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: DISCRETE 01005 / 0201 / 0402 TO
Packaging: Bulk
Size / Dimension: 0.400" L x 0.100" W (10.16mm x 2.54mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.036" (0.91mm)
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: SMD to SIP
Package Accepted: 0402
Description: DISCRETE 01005 / 0201 / 0402 TO
Packaging: Bulk
Size / Dimension: 0.400" L x 0.100" W (10.16mm x 2.54mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.036" (0.91mm)
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: SMD to SIP
Package Accepted: 0402
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Технічний опис DC0402T Chip Quik Inc.
Description: DISCRETE 01005 / 0201 / 0402 TO, Packaging: Bulk, Size / Dimension: 0.400" L x 0.100" W (10.16mm x 2.54mm), Material: FR4 Epoxy Glass, Number of Positions: 2, Pitch: 0.036" (0.91mm), Board Thickness: 0.031" (0.79mm) 1/32", Proto Board Type: SMD to SIP, Package Accepted: 0402.