DC1210T Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: DISCRETE 1210 TO 300MIL TH ADAPT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.150" W (10.16mm x 3.81mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.118" (3.00mm)
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: SMD to SIP
Package Accepted: 1210
Description: DISCRETE 1210 TO 300MIL TH ADAPT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.150" W (10.16mm x 3.81mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.118" (3.00mm)
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: SMD to SIP
Package Accepted: 1210
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Технічний опис DC1210T Chip Quik Inc.
Description: DISCRETE 1210 TO 300MIL TH ADAPT, Packaging: Bulk, Size / Dimension: 0.400" L x 0.150" W (10.16mm x 3.81mm), Material: FR4 Epoxy Glass, Number of Positions: 2, Pitch: 0.118" (3.00mm), Board Thickness: 0.031" (0.79mm) 1/32", Proto Board Type: SMD to SIP, Package Accepted: 1210.