DE02008 Dreyer Electronics LLC
Виробник: Dreyer Electronics LLC
Description: SOP-8/SSOP-8/SOIC-8 TO DIP-8
Part Status: Active
Package Accepted: SOIC, SOP, SSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.433" L x 0.472" W (11.00mm x 12.00mm)
Packaging: Bag
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Технічний опис DE02008 Dreyer Electronics LLC
Description: SOP-8/SSOP-8/SOIC-8 TO DIP-8, Part Status: Active, Package Accepted: SOIC, SOP, SSOP, Proto Board Type: SMD to DIP, Board Thickness: 0.063" (1.60mm), Pitch: 0.100" (2.54mm), Number of Positions: 8, Material: FR4 Epoxy Glass, Size / Dimension: 0.433" L x 0.472" W (11.00mm x 12.00mm), Packaging: Bag.