DE02014 Dreyer Electronics LLC

Description: SOP-14/SSOP-14/SOIC-14 TO DIP-14, Part Status: Active, Package Accepted: SOIC, SOP, SSOP, Proto Board Type: SMD to DIP, Board Thickness: 0.063" (1.60mm), Pitch: 0.100" (2.54mm), Number of Positions: 14, Material: FR4 Epoxy Glass, Size / Dimension: 0.740" L x 0.744" W (18.80mm x 18.90mm), Packaging: Bag.