DF7058SBPAKV Renesas Electronics Corporation
Виробник: Renesas Electronics Corporation
Description: MCU 3V 512K PB-FREE K-TEMP BP-27
Packaging: Tray
Package / Case: 272-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: SH-2E
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (21x21)
Number of I/O: 149
Description: MCU 3V 512K PB-FREE K-TEMP BP-27
Packaging: Tray
Package / Case: 272-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: SH-2E
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 272-BGA (21x21)
Number of I/O: 149
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Технічний опис DF7058SBPAKV Renesas Electronics Corporation
Description: MCU 3V 512K PB-FREE K-TEMP BP-27, Packaging: Tray, Package / Case: 272-BGA, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 1MB (1M x 8), RAM Size: 48K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: SH-2E, Data Converters: A/D 32x10b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: CANbus, SCI, SPI, UART/USART, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 272-BGA (21x21), Number of I/O: 149.