Продукція > SAMTEC INC. > DPAF-08-03.0-H-3-2-A

DPAF-08-03.0-H-3-2-A Samtec Inc.

dpaf-xx-03.0-x-x-x-xx%20footprint.pdf
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 36P SMD GOLD
Number of Rows: 3
Mated Stacking Heights: 10mm, 14mm, 17mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.254" (6.45mm)
Pitch: 0.085" (2.16mm)
Number of Positions: 36 Signal (18 Pair)
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Female
Features: Board Guide
Packaging: Tray
товару немає в наявності
В кошику  од. на суму  грн.
Відгуки про товар
Написати відгук

Технічний опис DPAF-08-03.0-H-3-2-A Samtec Inc.

Description: CONN DIFF ARRAY RCP 36P SMD GOLD, Number of Rows: 3, Mated Stacking Heights: 10mm, 14mm, 17mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.254" (6.45mm), Pitch: 0.085" (2.16mm), Number of Positions: 36 Signal (18 Pair), Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Female, Features: Board Guide, Packaging: Tray.