DSC1001AI1-003.6864 Microchip Technology
Виробник: Microchip Technology
Description: MEMS OSC., LOW POWER, 3.6864MHZ,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.6864 MHz
Base Resonator: MEMS
Description: MEMS OSC., LOW POWER, 3.6864MHZ,
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.6864 MHz
Base Resonator: MEMS
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Технічний опис DSC1001AI1-003.6864 Microchip Technology
Description: MEMS OSC., LOW POWER, 3.6864MHZ,, Packaging: Tube, Package / Case: 4-VDFN Exposed Pad, Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm), Mounting Type: Surface Mount, Output: CMOS, Function: Standby (Power Down), Type: XO (Standard), Operating Temperature: -40°C ~ 85°C, Frequency Stability: ±50ppm, Voltage - Supply: 1.8V ~ 3.3V, Ratings: AEC-Q100, Current - Supply (Max): 8mA, Height - Seated (Max): 0.035" (0.90mm), Frequency: 3.6864 MHz, Base Resonator: MEMS.