DSC6111HI1B-019.2000T Microchip Technology
Виробник: Microchip TechnologyDescription: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 19.2 MHz
Base Resonator: MEMS
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Технічний опис DSC6111HI1B-019.2000T Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM, Packaging: Tape & Reel (TR), Package / Case: 4-VFLGA, Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm), Mounting Type: Surface Mount, Output: CMOS, Function: Standby (Power Down), Type: XO (Standard), Operating Temperature: -40°C ~ 85°C, Frequency Stability: ±50ppm, Voltage - Supply: 1.8V ~ 3.3V, Current - Supply (Max): 3mA (Typ), Height - Seated (Max): 0.035" (0.89mm), Frequency: 19.2 MHz, Base Resonator: MEMS.