Технічний опис ECHU1H563JC9 Panasonic
Description: CAP FILM 0.056UF 5% 50VDC 1913, Packaging: Tape & Reel (TR), Tolerance: ±5%, Package / Case: 1913 (4833 Metric), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Termination: Solder Pads, Dielectric Material: Polyphenylene Sulfide (PPS), Metallized - Stacked, Voltage Rating - DC: 50V, Height - Seated (Max): 0.087" (2.20mm), Capacitance: 0.056 µF, Size / Dimension: 0.189" L x 0.130" W (4.80mm x 3.30mm).
Інші пропозиції ECHU1H563JC9
Фото | Назва | Виробник | Інформація |
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ECHU1H563JC9 | Виробник : Panasonic |
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товару немає в наявності |
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![]() |
ECH-U1H563JC9 | Виробник : Panasonic Electronic Components |
![]() Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: 1913 (4833 Metric) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Applications: General Purpose Termination: Solder Pads Dielectric Material: Polyphenylene Sulfide (PPS), Metallized - Stacked Voltage Rating - DC: 50V Height - Seated (Max): 0.087" (2.20mm) Capacitance: 0.056 µF Size / Dimension: 0.189" L x 0.130" W (4.80mm x 3.30mm) |
товару немає в наявності |
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ECH-U1H563JC9 | Виробник : Panasonic Electronic Components |
![]() Packaging: Cut Tape (CT) Tolerance: ±5% Package / Case: 1913 (4833 Metric) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Applications: General Purpose Termination: Solder Pads Dielectric Material: Polyphenylene Sulfide (PPS), Metallized - Stacked Voltage Rating - DC: 50V Height - Seated (Max): 0.087" (2.20mm) Capacitance: 0.056 µF Size / Dimension: 0.189" L x 0.130" W (4.80mm x 3.30mm) |
товару немає в наявності |