ED40DT On Shore Technology Inc.
Виробник: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 40POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 110°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 204.58 грн |
| 12+ | 165.18 грн |
| 36+ | 152.86 грн |
| 60+ | 138.37 грн |
| 108+ | 132.75 грн |
| 252+ | 125.04 грн |
| 504+ | 117.12 грн |
| 1008+ | 111.53 грн |
| 2508+ | 104.59 грн |
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Технічний опис ED40DT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 40POS TIN, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Operating Temperature: -55°C ~ 110°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.