Продукція > SAMTEC INC. > ERM8-013-05.0-L-DV-DS-EGP-K-TR

ERM8-013-05.0-L-DV-DS-EGP-K-TR Samtec Inc.

erm8-xxx-xx.x-dv-xxxx-footprint.pdf
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY PLG 26P SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 10mm, 12mm, 15mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.351" (8.91mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 26
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Board Guide, Mating Guide, Pick and Place
Packaging: Tape & Reel (TR)
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Технічний опис ERM8-013-05.0-L-DV-DS-EGP-K-TR Samtec Inc.

Description: CONN DIFF ARRAY PLG 26P SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 10mm, 12mm, 15mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.351" (8.91mm), Pitch: 0.031" (0.80mm), Number of Positions: 26, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Board Guide, Mating Guide, Pick and Place, Packaging: Tape & Reel (TR).