ESHF-115-01-F-D-RA Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER R/A 30POS 1.27MM
Packaging: Bulk
Features: Keying Slot
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.085" (2.16mm)
Insulation Height: 0.220" (5.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
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Технічний опис ESHF-115-01-F-D-RA Samtec Inc.
Description: CONN HEADER R/A 30POS 1.27MM, Packaging: Bulk, Features: Keying Slot, Connector Type: Header, Mounting Type: Through Hole, Right Angle, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.085" (2.16mm), Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).