ESHF-115-01-L-D-SM-K Samtec Inc.
Виробник: Samtec Inc.
Description: CONN HEADER SMD 30POS 1.27MM
Contact Length - Mating: 0.120" (3.05mm)
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 30
Mounting Type: Surface Mount
Connector Type: Header
Features: Keying Slot, Pick and Place
Packaging: Bulk
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.215" (5.45mm)
Contact Shape: Square
Part Status: Obsolete
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
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Технічний опис ESHF-115-01-L-D-SM-K Samtec Inc.
Description: CONN HEADER SMD 30POS 1.27MM, Contact Length - Mating: 0.120" (3.05mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 30, Mounting Type: Surface Mount, Connector Type: Header, Features: Keying Slot, Pick and Place, Packaging: Bulk, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.215" (5.45mm), Contact Shape: Square, Part Status: Obsolete, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze.