Продукція > SAMTEC INC. > ESQT-106-02-H-T-375

ESQT-106-02-H-T-375 Samtec Inc.


Виробник: Samtec Inc.
Description: CONN SOCKET 18POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.475" (12.07mm)
Insulation Height: 0.375" (9.53mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 3
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Технічний опис ESQT-106-02-H-T-375 Samtec Inc.

Description: CONN SOCKET 18POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 18, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Length - Post: 0.475" (12.07mm), Insulation Height: 0.375" (9.53mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 3.