
ESQT-110-02-M-Q-740 Samtec
на замовлення 12 шт:
термін постачання 21-30 дні (днів)
Кількість | Ціна |
---|---|
1+ | 738.99 грн |
10+ | 680.21 грн |
25+ | 519.39 грн |
50+ | 461.27 грн |
100+ | 437.73 грн |
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Технічний опис ESQT-110-02-M-Q-740 Samtec
Description: CONN SOCKET 40POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 40, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Contact Length - Post: 0.110" (2.79mm), Insulation Height: 0.740" (18.80mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 4.
Інші пропозиції ESQT-110-02-M-Q-740
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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ESQT-110-02-M-Q-740 | Виробник : Samtec Inc. |
![]() Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 40 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.740" (18.80mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 4 |
товару немає в наявності |