ESQT-115-02-L-D-378 Samtec Inc.

Description: CONN SOCKET 30POS 0.079 GOLD PCB, Number of Rows: 2, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.378" (9.60mm), Contact Length - Post: 0.472" (12.00mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 30, Mounting Type: Through Hole, Current Rating (Amps): 4.5A per Contact, Connector Type: Elevated Socket, Packaging: Tube.