ESQT-135-03-F-T-375 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN SOCKET 105P 0.079 GOLD PCB
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 3
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.375" (9.53mm)
Current Rating (Amps): 4.5A per Contact
Connector Type: Elevated Socket
Packaging: Bulk
Number of Positions: 105
Mounting Type: Through Hole
Contact Length - Post: 0.083" (2.11mm)
Part Status: Active
Відгуки про товар
Написати відгук
Технічний опис ESQT-135-03-F-T-375 Samtec Inc.
Description: CONN SOCKET 105P 0.079 GOLD PCB, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 3, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.375" (9.53mm), Current Rating (Amps): 4.5A per Contact, Connector Type: Elevated Socket, Packaging: Bulk, Number of Positions: 105, Mounting Type: Through Hole, Contact Length - Post: 0.083" (2.11mm), Part Status: Active.